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Record Of Intel Atom Microprocessors

The Intel Atom is Intel’s line of low-energy, low-cost and low-performance x86 and x86-sixty four microprocessors. Atom, with codenames of Silverthorne and Diamondville, was first introduced on March 2, 2008.

For Nettop and Netbook Atom Microprocessors after Diamondville, the reminiscence and graphics controller are moved from the northbridge to the CPU. This explains the drastically elevated transistor depend for publish-Diamondville Atom microprocessors.

Contents
1 Nettop processors (small desktop) 1.1 Bonnell microarchitecture 1.1.1 “Diamondville” (45 nm)
1.1.2 “Pineview” (forty five nm)
1.1.Three “Cedarview” (32 nm)

2.1 Bonnell microarchitecture 2.1.1 “Diamondville” (45 nm)
2.1.2 “Pineview” (forty five nm)
2.1.Three “Cedarview” (32 nm)

3.1 Bonnell microarchitecture 3.1.1 “Silverthorne” (forty five nm)
3.1.2 “Lincroft” (forty five nm)
3.1.Three “Penwell” (32 nm)

three.2.1 “Merrifield” (22 nm)
3.2.2 “Moorefield” (22 nm)
three.2.Three “SoFIA” (28 nm)
4.1 Bonnell microarchitecture 4.1.1 “Lincroft” (forty five nm)
4.1.2 “Cloverview” (32 nm)

4.2.1 “Bay Path-T” (22 nm)
4.3.1 “Cherry Path-T” (14 nm)

5.1 Bonnell microarchitecture 5.1.1 “Tunnel Creek” (forty five nm)
5.1.2 “Stellarton” (45 nm)
5.2.1 “Bay Trail-I” (22 nm)

5.3.1 “Braswell” (14 nm)
5.Four.1 “Apollo Lake” (14 nm)

6.1 Bonnell microarchitecture 6.1.1 “Centerton” (32 nm)
6.1.2 “Briarwood” (32 nm)
6.2.1 “Avoton” (22 nm)
6.2.2 “Rangeley” (22 nm)

6.3.1 “Denverton” (14 nm)
7.1 Single-core CE SoCs 7.1.1 “Sodaville” (forty five nm)
7.1.2 “Groveland” (forty five nm)

7.2.1 “Berryville” (32 nm)
Nettop processors (small desktop)[edit]

– All fashions support: MMX, SSE, SSE2, SSE3, SSSE3, Intel sixty four, XD bit (an NX bit implementation), hyper-threading
– These models don’t assist Intel VT-x or SSE4.
– Transistors: 47 million
– Die size: 25.96 mm² (three.27 × 7.94)
– Package deal dimension: 22 mm × 22 mm
– Steppings: C0

– SLB6Z (C0)
– AU80586RE025D

– SLG9Y (C0)
– AU80587RE0251M

– All models assist: MMX, SSE, SSE2, SSE3, SSSE3, Intel sixty four, XD bit (an NX bit implementation), hyper-threading
– These fashions do not help Intel VT-x or SSE4.
GMA 3150 GPU and reminiscence controller are integrated into the processor.
– Transistors: 123 million (single-core), 176 million (dual-core)
– Die measurement: 66 mm² (9.Fifty six × 6.89) (single-core), 87 mm² (9.Fifty six × 9.06) (dual core)
– Package deal dimension: 22 mm × 22 mm

– SLBMH (A0)
– AU80610004671AA

– SLBXD (A0)
– AU80610006252AA

– SLBLA (B0)
– AU80610004392AA

– SLBXC (B0)
– AU80610006225AA

– All fashions support: MMX, SSE, SSE2, SSE3, SSSE3, Intel sixty four, XD bit (an NX bit implementation), hyper-threading (D2550, D2560, D2700, D2701[1] only)
– These models don’t assist SSE4.
PowerVR-based mostly Intel GMA 3600/GMA 3650 GPU and memory controller are built-in into the processor.
– Transistors:
– Die dimension:
– Package deal measurement: 22 mm × 22 mm

– SR0D8 (B2)
– SR0W0 (B3)
– DF8064101055400

– SR0QB (B2)
– SR0VY (B3)
– DF8064101211300

– SR0QD (B2)
– SR0W4 (B3)
– DF8064101213700

– SR0D9 (B2)
– DF8064101055647

– SR0W6 (unknown)
– unknown

– DF8064101365900[2]
Netbook processors (sub-notebook)[edit]

“Diamondville” (45 nm)[edit]
– All fashions support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), hyper-threading
– These models don’t assist Intel sixty four, Intel VT-x, or SSE4.
– Transistors: Forty seven million
– Die measurement: 26 mm²
– Bundle measurement: 22 mm × 22 mm
Steppings: C0

– SLB73 (C0)
– AU80586GE025D

– SLGL9 (C0)
– AU80586GF028D

“Pineview” (forty five nm)[edit]
– All models help: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), hyper-threading
– These fashions do not support Intel VT-x or SSE4 and are restricted to 2GB of memory.
– Graphics GMA 3150 and reminiscence controller are integrated into the processor, but graphics sometimes disabled in favor of discrete video chip.
– Transistors: 123 million (single-core), 176 million (twin-core)
– Die size: 66 mm² (9.56 × 6.89) (single-core), 87 mm² (9.Fifty six × 9.06) (dual core)
– Bundle size: teenage mutant ninja turtles t shirt 3d 22 mm × 22 mm

– SLC4C (A0)
– AU80610007533AA

– SLBMG (A0)
– AU80610004653AA

– SLBX9 (A0)
– AU80610006237AA

– SLBMF (A0)
– AU80610003495AA

– SLBX5 (A0)
– AU80610006240AA

– SLBXF (B0)
– AU80610006291AA

– SLBXE (B0)
– AU80610006243AA

“Cedarview” (32 nm)[edit]
– All models help: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Know-how (EIST), XD bit (an NX bit implementation), hyper-threading
– These models don’t assist Intel VT-x or SSE4.
– Intel GMA 3600/GMA 3650 GPU and memory controller are built-in into the processor.
– Transistors: million
– Die measurement:
– Bundle size: 22 × 22 mm

– SR0DC (B2)
– DF8064101064902

– SR0DB (B2)
– SR0W2 (B3)
– DF8064101050706

– SR0DA (B2)
– SR0W1 (B3)
– FC-BGA 559

– DF8064101050503
MID processors/SoCs (UMPC/Smartphone/IoT)[edit]

“Silverthorne” (forty five nm)[edit]
– All fashions support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Expertise (EIST), XD bit (an NX bit implementation)
– Models Z520, Z520PT, Z530, Z530P, Z540, Z550 and Z560 support Hyper-Threading and Intel VT-x
– Fashions Z500, Z510P, Z510PT, and Z515 help Hyper-Threading only
– Mannequin Z515 helps Intel Burst Efficiency Technology
– Transistors: Forty seven million
– Die measurement: 26 mm²
– Package measurement: 13 mm × 14 mm / 22 mm × 22 mm (processors ending with the P or PT sSpec quantity)
– Steppings: C0

– SLB6Q (C0)
– AC80566UC800DE

– SLB2C (C0)
– AC80566UC005DE

– SLGPQ (C0)
– CH80566EC005DW

– SLGPR (C0)
– CH80566EC005DT

– SLGMG (C0)
– AC80566UC009DV

– SLB2H (C0)
– AC80566UE014DW

– SLGPP (C0)
– CH80566EE014DT

– SLB6P (C0)
– AC80566UE025DW

– SLGPN (C0)
– CH80566EE025DW

– SLB2M (C0)
– AC80566UE036DW

– SLGPT (C0)
– AC80566UE041DW

– SLH63 (C0)
– AC80566UE046DW

– SLBZP (C0)
– SLBR9
– AY80609004002AC

– SLC3C (C0)
– SLBSA
– SLC3C
– AY80609005805AA

– SLBZQ (C0)
– SLBS7
– AY80609005793AA

– SLBZN (C0)
– SLBS8
– AY80609003042AC

– SLBZL (C0)
– SLBS9
– AY80609005802AA

– SLBZE (C0)
– SLBR8
– AY80609003996AC

– SLBZD (C0)
– SLBR7
– AY80609003987AB

“Penwell” (32 nm)[edit]
– All fashions support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Expertise (EIST), XD bit (an NX bit implementation), Intel Burst Efficiency Technology (BPT), Hyper-threading.
– GPU and reminiscence controller are built-in onto the processor die
– Bundle size: 12 mm × 12 × 1.Zero mm
– Steppings: D1
– At the moment used within the Motorola RAZR i smartphone.

– SR0YF (D1)
– SR0Z5 (D1)
– DG8064001195908

– SR0PR (D1)
– SR0PS (D1)
– SR0PV (D1)
– SR0TM (D1)
– SR0U6 (D1)
– SR0VZ (D1)
– SR114 (D1)
– SR118 (D1)

– DG8064001211503
– DG8064001194903
– DG8064001195902
– DG8064001195703
– SR0U7 (D1)
– SR0ZK (D1)
– SR111 (D1)
– SR117 (D1)

– DG8064001195906
– DG8064001195906
– DG8064001195906
– DG8064001195906
– SR0PT (D1)

– BGA617
– DG8064001196004

“Merrifield” (22 nm)[edit]
– All fashions support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Know-how (EIST), XD bit (an NX bit implementation), Intel VT-x, AES-NI, Intel Burst Performance Expertise (BPT).
– Z3480 also helps Intel Wireless Display.
– GPU (PowerVR G6400) and reminiscence controller are integrated onto the processor die
– Package deal dimension: 12 mm × 12 × 1.Zero mm

– SR1WR (B1)
– SR20G (B1)
– SR20U (B1)
– FG8065201850100

– SR1WS (B1)
– SR20F (B1)
– FG8065201850200

“Moorefield” (22 nm)[edit]
– All fashions support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Expertise (EIST), XD bit (an NX bit implementation), Intel VT-x, AES-NI, Intel Burst Performance Technology (BPT), Intel Wireless Show.
– GPU (PowerVR G6430) and memory controller are built-in onto the processor die
– Bundle size: 14 mm × 14 × 1.0 mm

– SR1YR (B0)
– GA8066301896101

– SR1WW (B0)
– SR1WX (B0)
– GA8066301600200

– SR1WU (B0)
– SR1WV (B0)
– GA8066301600100

– SR2GC (B0)
– SR2GD (B0)
– GA8066301828200

“SoFIA” (28 nm)[edit]
– SoFIA (Sensible or Function teenage mutant ninja turtles t shirt 3d Cellphone with Intel Architecture)[three]
– All fashions help: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Burst Efficiency Know-how (BPT), Intel VT-x, AES-NI (based on Silvermont’s specs)
– GPU (ARM Mali) and memory controller are built-in onto the processor die
– Bundle size: 34 × 40 mm
– SoFIA 3G SoC with Silvermont CPU – Built-in HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3130)[four]

– Built-in HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3230RK)[5]
– Built-in LTE Cat. 4 (XG726-based mostly), SMARTi™ four.5, LnP/ CG2000, PMIC (Atom x3-C3440 & C3445)[6]

– SLKZW
– SLKYS
– SLL4C
– PMB8016.P10
– PMB8016.P20
– PMB8016.P10

– PMB9102.P11
– PMB8016.P20
– SLKZQ
– SLKYT
– SLL4B

– PMB8018.P10
– PMB8018.P20
– PMB8018.P10
– PMB9103.P11
– PMB8016T.P20

– SR2G0
– PMB8020.P20

Tablet processors/SoCs[edit]
“Lincroft” (forty five nm)[edit]

– All models help: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Know-how (EIST), XD bit (an NX bit implementation), Hyper-Threading. All except Z605 help Intel Burst Performance Expertise (BPT).
GMA 600 GPU and memory controller are integrated onto the processor die
– Transistors: 140 million
– Die size: 7.34 mm × eight.89 mm = sixty five.2526 mm²
– Package measurement: 13.Eight mm × 13.Eight × 1.0 mm
– Steppings: C0

– SLC2Q (C0)
– AY80609007296AA

– SLC2P (C0)
– AY80609007293AA

“Cloverview” (32 nm)[edit]
– All fashions support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading, Intel Burst Performance Technology (BPT).
– GPU and memory controller are integrated onto the processor die
– Package deal dimension: 13.Eight mm × 13.Eight × 1.Zero mm
– Steppings:B1, C0

– SR161 (B1)
– DG8065101533700

– SR145 (B1)
– DG8065101274708

– SR12U (C0)
– SR12V (C0)
– SR146 (B1)
– DG8065101418902
– DG8065101418900

– SR0WW (C0)
– SR0Z4 (C0)
– FC-MB4760

– DG8065001313500
No official TDP available. For energy information see [7] web page 129-130.

“Bay Trail-T” (22 nm)[edit]
– All models assist: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Know-how (EIST), Intel sixty four, XD bit (an NX bit implementation), Intel Burst Performance Know-how (BPT), Intel VT-x, AES-NI.
– GPU and reminiscence controller are integrated onto the processor die
– GPU relies on Ivy Bridge Intel HD Graphics, with four execution items, and supports DirectX 11, OpenGL four.0, OpenGL ES three.1 and OpenCL 1.1 (on Windows).
– Package measurement: 17 mm × 17 × 1.0 mm

– SR1S2 (B3)
– FH8065301455695

– SR1S4 (B3)
– FH8065301574827

– SR1U7 (C0)
– FH8065301685597

– SR1U9 (C0)
– FH8065301685963

– SR1UB (C0)
– FH8065301685598

– SR1UD (C0)
– FH8065301685965

– SR20D (C0)
– FH8065301685500

– SR20E (C0)
– FH8065301685971

– SR1M5 (B2)
– SR1RW (B3)
– FH8065301455601
– FH8065301455693

– SR1M9 (B2)
– SR1S0 (B3)
– FH8065301574801
– FH8065301574825

– SR1SP (C0)
– FH8065301455630

– SR1ST (C0)
– FH8065301574844

– SR1M3 (B2)
– SR1RU (B3)
– FH8065301455604
– FH8065301455691

– SR1M7 (B2)
– SR1RY (B3)
– FH8065301574800
– FH8065301574823

– SR1SM (C0)
– FH8065301455629

– SR1SR (C0)
– FH8065301574843

– SR1V9 (C0)
– FH8065301455637

– SR1SK (C0)
– FH8065301455628

“Cherry Trail-T” (14 nm)[edit]
– All models assist: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Expertise (EIST), Intel sixty four, XD bit (an NX bit implementation), Intel VT-x2 (VT-x with EPT, FlexMigration, FlexPriority and VPID[eight][9]), AES-NI.[10]
– GPU and reminiscence controller are built-in onto the processor die
– GPU relies on 8th generation (Broadwell) Intel HD Graphics, with 12 (x5 models) or sixteen (x7 models) execution units, and helps DirectX eleven.2, OpenGL 4.3, OpenGL ES three.1 and OpenCL 1.2 (on Windows).
– Bundle size: 17 mm × 17 × 1.Zero mm

– SR29Z (C0)
– FJ8066401836609

– SR2KT (D1)
– UTFCBGA592

– FJ8066401836620
– SR27N (C0)
– SR2GN (C0)

– FJ8066401715814
– FJ8066401715842
– SR2KH (D1)

– FJ8066401715843
– SR27M (C0)
– SR29W (C0)

– FJ8066401715809
– FJ8066401715825
– SR2KG (D1)

– UTFCBGA1380
– FJ8066401715827

Embedded processors/SoCs[edit]
“Tunnel Creek” (forty five nm)[edit]

– CPU core helps IA-32 structure, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Expertise (EIST), hyper-threading, Intel VT-x. It has 32K L1 Instruction Cache, 24K L1 Information Cache, 512K L2 Cache.
– Peripherals embrace GMA 600 GPU (two video outputs), memory controller (2GB max), HD Audio controller, SPI controller, four channels of PCI Specific ×1, and various legacy devices.[11]
– Bundle size: 22 mm × 22 mm
– Steppings: B0
– Temperature vary: for (E620, E640, E660, E680): 0°C to +70°C, for (E620T, E640T, E660T, E680T): -40°C to +85°C.

– SLH56 (B0)
– SLJ32 (B1)
– CT80618005844AA

– SLH5N (B0)
– SLJ36 (B1)
– CT80618005844AB

– SLH55 (B0)
– SLJ33 (B1)
– CT80618005841AA

– SLH5M (B0)
– SLJ37 (B1)
– CT80618005841AB

– SLH54 (B0)
– SLJ34 (B1)
– CT80618003201AA

– SLH5L (B0)
– SLJ38 (B1)
– CT80618003201AB

– SLH94 (B0)
– SLJ35 (B1)
– CT80618007035AA

– SLH95 (B0)
– SLJ39 (B1)
– CT80618007035AB

“Stellarton” (45 nm)[edit]
– “Tunnel Creek” CPU with an Altera Field Programmable Gate Array (FPGA)
– CPU core helps IA-32 structure, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Know-how (EIST), hyper-threading, Intel VT-x. It has 32K L1 Instruction Cache, 24K L1 Information Cache, 512K L2 Cache.
– Peripherals embody graphics controller (two video outputs), memory controller (2GB max), HD Audio controller, SPI controller, 4 channels of PCI Specific ×1, and numerous legacy units.[Eleven][12]
– Package deal size: 37.5 mm × 37.5 mm
– Steppings: B0
– TDP with out FPGA. Total package TDP relies on features included in FPGA. Max. TDP 7 W.
– Temperature range: for (E625C, E645C, E665C): 0°C to +70°C, for (E625CT, E645CT, E665CT): -40°C to +85°C.

– SLH9Z (B0)
– CY80632007227AB

– SLH9K (B0)
– CY80632007227AA

– SLH9Y (B0)
– CY80632007221AB

– SLH9J (B0)
– CY80632007221AA

– SLH9X (B0)
– CY80632007224AB

– SLH9H (B0)
– FC-BGA 1466

– CY80632007224AA
“Bay Path-I” (22 nm)[edit]

– All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC reminiscence.
– GPU and memory controller are integrated onto the processor die
– GPU is based on Ivy Bridge Intel HD Graphics, with four execution models, and supports 2 displays, DirectX eleven, OpenGL 4.Zero, OpenGL ES 3.1 and OpenCL 1.1 (on Home windows).
– Peripherals embody USB 2.Zero, HD Audio controller, SATA with 2 ports, UART, and 4 lanes of PCI Categorical 2.Zero, in x4, x2, Sinestro and x1 configurations.
– Package measurement: 25 mm × 27 mm

– SR1RA (B3)
– SR1XA (D0)
– FH8065301567411
– FH8065301567414

– SR20Y (D0)
– FH8065301989700

– SR1RB (B3)
– SR1X9 (D0)
– FH8065301567311
– FH8065301567313

– SR1RC (B3)
– SR1X8 (D0)
– FH8065301542213
– FH8065301542215

– SR1RD (B3)
– SR1X7 (D0)
– FH8065301487916
– FH8065301487918

– SR1RE (B3)
– SR1X6 (D0)
– FH8065301487715
– FH8065301487717

Airmont microarchitecture[edit]
“Braswell” (14 nm)[edit]

– All fashions support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Know-how (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI.
– GPU and memory controller are built-in onto the processor die
– GPU is predicated on Broadwell Intel HD Graphics, with 12 execution units, and helps DirectX eleven.2, OpenGL 4.3, OpenGL ES three.0 and OpenCL 1.2 (on Home windows).
– Package deal dimension: 25 mm × 27 mm

– SR2LV (D1)
– FC-BGA 1170

– FH8066501715946
“Apollo Lake” (14 nm)[edit]

– All models assist: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Expertise (EIST), Intel sixty four, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, ECC memory (DDR3).
– GPU and memory controller are built-in onto the processor die
– GPU is based on Skylake Intel HD Graphics, with 12 (x5) or 18 (x7) execution items, and supports HDMI 1.Four (4K @ 30Hz), DP 1.2 (4K @ 60Hz), and eDP 1.Three (4K @ 60Hz).
– Package deal size: 24 mm × 31 mm

– FC-BGA 1296
Server SoCs[edit]

All Atom server processors embody ECC assist.
Bonnell microarchitecture[edit]

“Centerton” (32 nm)[edit]
– SLK2K (B1)

– DH80S1220
– SLK2J (B1)

– DH80S1240
– SLK2H (B1)

– DH80S1260
“Briarwood” (32 nm)[edit]

– Steppings: B1
– SLK2G (B1)

– DH80S1269
– SLK2F (B1)

– DH80S1279
– SLK2E teenage mutant ninja turtles t shirt 3d (B1)

– DH80S1289
Silvermont microarchitecture[edit]

“Avoton” (22 nm)[edit]
– All models help: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Enhance, Intel 64 (according to Datasheet), XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC reminiscence.
– Twin-core SoC peripherals include four × USB 2.0, 2 × SATA, 2 × Built-in GbE LAN, 2 × UART, and 4 lanes of PCI Specific 2.0, in x4, x2, and x1 configurations.
– Quad-core SoC peripherals embrace four × USB 2.Zero, 2 (C2530) or 6 (C2550) × SATA, 2 × Integrated GbE LAN, 2 × UART, and eight lanes of PCI Specific 2.Zero, in x8, x4, x2, and x1 configurations.
– C2730 SoC peripherals include 4 × USB 2.0, 2 × SATA, 2 × Built-in GbE LAN, 2 × UART, and 8 lanes of PCI Express 2.0, in x8, x4, x2, and x1 configurations.
– C2750 SoC peripherals include 4 × USB 2.Zero, 6 × SATA, four × Integrated GbE LAN, 2 × UART, and sixteen lanes of PCI Categorical 2.Zero, in x16, x8, x4, x2, and x1 configurations.
– Package dimension: 34 mm × 28 mm

– SR1CV (B0)
– FH8065401488914

– SR1CU (B0)
– FH8065401488915

– SR1CT (B0)
– FH8065401488912

– SR1CR (B0)
– FH8065401488919

– SR1CS (B0)
– FH8065401488906

“Rangeley” (22 nm)[edit]
– All fashions help: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Expertise (EIST), Intel Turbo Increase, Intel sixty four, XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory.
– All fashions except C2x38 support Intel QuickAssist Know-how (cryptography accelerator)
– Twin-core SoC peripherals include 4 × USB 2.0, 4-6 × SATA (1 for C2308, 2 for C2316), 4 × Integrated GbE LAN (2 for C2316), 2 × UART, and 8 lanes of PCI Specific 2.0 (four lanes for C2308), in x2 and x1 configurations.
– Quad-core SoC peripherals embrace four × USB 2.Zero, 6 × SATA (2 for C2508, C2516), 4 × Built-in GbE LAN, 2 × UART, and 16 lanes of PCI Express 2.0 (8 lanes for C2508, C2516), in x16, x8, x4, x2, and x1 configurations.
– Eight-core SoC peripherals embody four × USB 2.Zero, 6 × SATA, four × Built-in GbE LAN, 2 × UART, and sixteen lanes of PCI Express 2.0, in x16, x8, x4, x2, and x1 configurations.
– Bundle size: 34 mm × 28 mm

– SR1UN (B0)
– FH8065501516754

– SR3JU (C0)
– FH8065503680000

– SR1S8 (B0)
– FH8065501516761

– SR1D2 (B0)
– FH8065501516711

– SR1VV (B0)
– FH8065501516768

– SR3JV (C0)
– FH8065503680100

– SR1D1 (B0)
– FH8065501516710

– SR1S9 (B0)
– FH8065501516762

– SR1CZ (B0)
– FH8065501516709

– SR1CY (B0)
– FH8065501516708

– SR1SA (B0)
– FH8065501516763

– SR1CW (B0)
– FC-BGA 1283

– FH8065501516702
Goldmont microarchitecture[edit]

“Denverton” (14 nm)[edit]
– All models assist: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost (dual-core, C3xx0, C3xx5 solely), Intel sixty four, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, ECC reminiscence.
SoC peripherals include 8-sixteen × USB three.Zero, 6-sixteen × SATA (C3xx8 only), four × Integrated 1GbE, 2.5GbE, and 10GbE (C3538 and up) LAN, and as much as 20 lanes of PCI Express 3.Zero, in x8, x4, and x2 configurations.
– Package measurement: 34 mm × 28 mm

– SR38D (B1)
– HW8076502639802

– SR36E (B0)
– SR38B (B1)
– HW8076502639602

– SR3JX (B1)
– HW8076503693501

– SR3L7 (B1)
– HW8076502444301

– SR388 (B1)
– HW8076502639302

– SR38F (B1)
– HW8076502640002

– SR385 (B1)
– HW8076502639002

– SR389 (B1)
– HW8076502639402

– SR38C (B1)
– HW8076502639702

– SR386 (B1)
– HW8076502639101

– SR387 (B1)
– HW8076502639201

– SR38A (B1)
– HW8076502639501

– SR383 (B1)
– HW8076502638901

– SR3F3 (B1)
– HW8076503528301

– SR381 (B1)
– FC-BGA 1310

– HW8076502444202
CE SoCs[edit]

Single-core CE SoCs[edit]
“Sodaville” (45 nm)[edit]

[13]
– Bundle size: 27 mm × 27 mm
– GPU (primarily based on the PowerVR SGX535 from Imagination Applied sciences)

FC-BGA 951
– FC-BGA 951

“Groveland” (forty five nm)[edit]
CE4200[14]

– Package deal dimension: mm × mm
– 2 × 32-bit reminiscence channels, up to DDR2-800
– GPU (based mostly on the PowerVR SGX535 from Imagination Technologies)

FC-BGA 676
Twin-Core CE SoCs[edit]

“Berryville” (32 nm)[edit]
[15][16][17]

– Package measurement: mm × mm
– GPU for 3D (based on the PowerVR SGX545 from Imagination Applied sciences)
– GPU for 2D (GC300 from Vivante)

See additionally[edit]
Atom (system on chip)
Comparison of Intel processors
Listing of Intel Celeron microprocessors
Intel GMA
Stealey (microprocessor) (A100/A110)
Geode (processor)
Via Nano
Intel Quark
Intel Edison

References[edit]
^ Ganesh T S (eleven November 2013). “Netgear ReadyNAS 312 2-bay SMB / SOHO NAS Evaluate”. Anandtech.com. Retrieved 5 April 2015.
^ Intel (3 February 2014). “Product Change Notification #112810 – 00” (PDF). Intel.com. Retrieved 5 April 2015.
^ https://www.theregister.co.uk/2016/02/23/transfer_over_continuum_intel_shows_android_smartphone_powering_bigscreen_linux/
^ Rockchip#Tablet processors with built-in modem
^ Rockchip#Tablet processors with built-in modem
^ Rockchip#Tablet processors with built-in modem
^ https://www-ssl.intel.com/content/dam/www/public/us/en/documents/product-briefs/atom-z2760-datasheet.pdf
^ “What precisely is VT-x2 “. Software program.intel.com. 2009-03-30. Retrieved 2016-04-22.
^ http://www.intel.com/content/dam/www/public/us/en/paperwork/white-papers/virtualization-enabling-intel-virtualization-technology-features-and-advantages-paper.pdf
^ “Intel® Atom™ Processor Z8000 Collection Datasheet, Vol. 1”. Ssl.intel.com. Retrieved 2016-04-22.

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